Characterization of copper metallization for interconnect by 90°-bend electromagnetic filtered vacuum arc

Nuclear Instruments and Methods in Physics Research, Section B: Beam Interactions with Materials and Atoms

Volumn 237, Issue 1-2, 2005, Pages 477-483

  Chen, Uei Shin ^a   Shih, Han C ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Adhesion; EBSD; Magnetic filter; Orientation; ULSI

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; MAGNETIC FILTERS; MAGNETOELECTRIC EFFECTS; METALLIZING; OPTICAL INTERCONNECTS; PLASMA DENSITY; SCANNING ELECTRON MICROSCOPY; THIN FILMS; ULSI CIRCUITS; VAPOR DEPOSITION;

EBSD; MACRO-PARTICLES; ORIENTATION; ULSI;

COPPER;

EID: 23444459382     PISSN: 0168583X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nimb.2005.05.018     Document Type: Conference Paper

References (10)

1. P.J. Martin, A. Bendavid, and H. Takikawa J. Vac. Sci. Technol. A 17 1999 2351
2. M.M.M. Bilek, P. Evans, D.R. Mckenzie, D.G. McCulloch, H. Zreiqat, and C.R. Howlett J. Appl. Phys. 87 2000 4198
3. I.I. Aksenov, V.A. Belous, V.G. Padalka, and V.M. Khoroshikh Sov. J. Plasma Phys. 4 1978 425
4. I.I. Aksenov, V.A. Belous, and V.G. Padalka Instr. Exp. Technol. 21 1978 1416
5. Aksenov, V.A. Belous, and V.G. Padalka Sov. J. Plasma Phys. 4 1978 428
6. A. Anders, S. Anders, and I.G. Brown Plasma Source Sci. Technol. 76/77 1995 167
7. T. Zhang, P.K. Chu, and I.G. Brown Appl. Phys. Lett. 80 2002 3700
8. A. Anders, S. Anders, and I.G. Brown J. Appl. Phys. 75 1994 4900
9. J.-H. Lin, W.-J. Hsieh, J.-W. Hsu, X.-W. Liu, U.-S. Chen, and H.C. Shih J. Vac. Sci. Technol. B 20 2002 561
10. I.G. Brown Rev. Sci. Instr. 65 1994 3061