A new residual stress measurement method using ultra-wide micromachined bilayer cantilevers

Journal of Micromechanics and Microengineering

Volumn 14, Issue 4, 2004, Pages 490-496

  Hou, Max Ti Kuang ^a   Chen, Rongshun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; CANTILEVER BEAMS; DEFLECTION (STRUCTURES); ELECTRIC POTENTIAL; MICROELECTROMECHANICAL DEVICES; PLATES (STRUCTURAL COMPONENTS); RESIDUAL STRESSES; THIN FILMS;

BUCKLING LENGTHS; CANTILEVER DEFLECTION; CANTILEVER LENGTH; STRESS MEASUREMENTS;

MICROMACHINING;

EID: 2342557211     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/4/008     Document Type: Article

References (22)

1. Min Y-H and Kim Y-K 2000 In situ measurement of residual stress in micromachined thin films using a specimen with composite-layered cantilevers J. Micromech. Microeng. 10 314-21
2. Fang W and Wickert J A 1995 Comments on measuring thin-film stresses using bi-layer micromachined beams J. Micromech. Microeng. 5 276-81
3. Stoney G G 1909 The tension of metallic films deposited by electrolysis Proc. R. Soc. 9 172-5
4. Mehregany M, Howe R and Senturia S 1987 Novel microstructures for the in situ measurement of the mechanical properties of thin films J. Appl. Phys. 62 3579-84
5. Zavracky P M, Adams G G and Aquilino P D 1995 Strain analysis of silicon-on-insulator films produced by zone melting recrystallization J. Microelectromech. Syst. 4 42-8
6. Gianchandani Y and Najafi K 1996 Bent-beam strain sensors J. Microelectromech. Syst. 5 52-8
7. Ericson F, Greek S, Söderkvist J and Schweitz J-Å 1997 High-sensitivity surface micromachined structures for internal stress and stress gradient evaluation J. Micromech. Microeng. 7 30-6
8. Guckel H, Randazzo T and Burns D W 1985 A simple technique for the determination of mechanical strain in thin films with applications to polysilicon J. Appl. Phys. 57 1671-5
9. Guckel H, Burns D, Rutigliano C, Lovell E and Choi B 1992 Diagnostic microstructures for the measurement of intrinsic strain in thin films J. Micromech. Microeng. 2 86-95
10. Tabata O, Kawahata K, Sugiyama S and Igarashi I 1989 Mechanical property measurements of thin film using load-deflection of composite rectangular membrane Proc. IEEE Microelectromech. Syst. pp 152-6
11. Maier-Schneider D, Maibach J, Obermeier E and Schneider D 1995 Variations in Young's modulus and intrinsic stress of LPCVD-polysilicon due to high-temperature annealing J. Micromech. Microeng. 5 121-4
12. Zhang L M, Uttamchandani D and Clushaw B 1991 Measurement of the mechanical properties of silicon microresonators Sensors Actuators A 29 79-84
13. Gianchandani Y and Najafi K 1992 A bulk silicon dissolved wafer process for microelectromechanical devices J. Microelectromech. Syst. 1 77-85
14. Najafi K and Suzuki K 1989 A novel technique and structure for the measurement of intrinsic stress and Young's modulus of thin films Proc. IEEE Microelectromech. Syst. 96-7
15. Osterberg P M and Senturia S D 1997 M-TEST: a test chip for MEMS material property measurement using electrostatically actuated test structures J. Microelectromech. Syst. 6 107-18
16. Chen S, Baughn T V, Yao Z J and Goldsmith C L 2002 A new in situ residual stress measurement method for a MEMS thin fixed-fixed beam structure J. Microelectromech. Syst. 11 309-16
17. Baker M S, de Boer M P, Smith N F, Warne L K and Sinclair M B 2002 Integrated measurement-modeling approaches for evaluating residual stress using micromachined fixed-fixed beams J. Microelectromech. Syst. 11 743-53
18. Hou M T-K and Chen R 2003 Effect of width on the stress-induced bending of micromachined bilayer cantilevers J. Micromech. Microeng. 13 141-8
19. Dunn M L, Zhang Y and Bright V M 2002 Deformation and structural stability of layered plate microstructures subjected to thermal loading J. Microelectromech. Syst. 11 372-84
20. Timoshenko S P and Goodier J N 1970 Theory of Elasticity (New Yor: McGraw-Hill) chapter 2 pp 15-7
21. Ugural A C 1999 Stresses in Plates and Shells (New York: McGraw-Hill) chapter 3 pp 71-84
22. Roark R J and Young W C 1975 Formulas for Stress and Strain (New York: McGraw-Hill) chapter 10 p 377