Methodology for accurate junction temperature estimation of SIP(System in Package)

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn 20, Issue , 2004, Pages 117-121

  Im, Yunhyeok ^a   Kwon, Heunghyu ^a   Kim, Senyun ^a   Kim, Tongsuk ^a   Cho, Taeje ^a   Oh, Seyong ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

BGA; DOE; Electronic package; MCP; Multichip Package; RSM; SIP; Superposition; System in Package; Thermal characterization; Thermal management; Thermal performance

Indexed keywords

COSTS; ELECTRONICS ENGINEERING; HEAT LOSSES; HEAT RESISTANCE; MATHEMATICAL MODELS; MULTICHIP MODULES; QUALITY ASSURANCE; THERMODYNAMICS;

BGA; DOE; ELECTRONIC PACKAGES; MULTICHIP PACKAGES (MIC); RESPONSE SURFACE METHOD (RSM); SYSTEM IN PACKAGE (SIP); THERMAL CHARACTERIZATION; THERMAL MANAGEMENT; THERMAL PERFORMANCE;

ELECTRONICS PACKAGING;

EID: 2342541639     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Balwant S. Lall, Bruce M. Guenin, Ronald J. Molnar, "Methodology for Thermal Evaluation of Multichip Modules", Proc of IEEE Transaction on Components, Packaging, and Manufacturing Technology Part A, Vol. 18, No.4, pp.758-764, 1995.
2. Bret A. Zahn, "Steady State Thermal Characteriztion of Muliput Output Devices Using Linear Superposion Theory and a Non-Liear Matrix Multiplier", Proc of 14th IEEE SEMI-THERM, pp. 39-46, 1998.
3. Bret A. Zahn, "Steady State Thermal Characterization and Junction Temperature Estimation of Multichip Module Packages Using the Response Surface Method", Proc of IEEE Transaction on Components and Packaging Technology, Vol. 23, No.1, pp.33-39, 2000.
4. Heung-Kyu Kwon, Tae-Je Cho, Se-Nyun Kim, Ki-Won Choi, Yun-Hyeok Im, Nam-Seog Kim, Heeseok Lee, Dong-Kil Shin, Seung-Bae Lee, Jong-Bo Shim, Ki-Myong Yoon, and Se-Yong Oh, "SIP solution for high-end multimedia cellular phone", Proc of International Symposium on Microelectronics, Session TP2, 2003
5. rd Ed, Wiley Interscience Publication (New York, 2001), pp. 244.