Sip Solution for High-End Multimedia Cellular Phone

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5288, Issue , 2003, Pages 223-228

  Kwon, Heung Kyu ^a   Cho, Tae Je ^a   Kim, Se Nyun ^a   Choi, Ki Won ^a   Im, Yun Hyeok ^a   Kim, Nam Seog ^a   Lee, Heeseok ^a   Shin, Dong Kil ^a   Lee, Seung Bae ^a   Shim, Jong Bo ^a   Yoon, Ki Myong ^a   Oh, Se Yong ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Cellular phone; Chip stack; Discrete package; Flip chip; PDA; SIP; SOC; Wire bonding

Indexed keywords

DATA STORAGE EQUIPMENT; ENERGY UTILIZATION; FLIP CHIP DEVICES; PACKAGING MATERIALS; QUALITY ASSURANCE; SILICON; VIDEO CAMERAS;

CHIP STACK; SYSTEM IN (A) PACKAGE (SIP); SYSTEM ON (A) CHIP (SOC); WIRE BONDING;

CELLULAR TELEPHONE SYSTEMS;

EID: 2342527917     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Balwant S. Lall, "Methodology for Thermal Evaluation of Multichip Modules", IEEE Transctions on components, packaging, and manufacturing Technology - Part A. Vol. 18, No. 4, December 1995, pp.758-764
2. Mark I. Montrose, "EMC and the printed circuit board; Design, theory and layout made simple"