Properties of conductive adhesives based on different curing agents

Journal of Electronics Manufacturing

Volumn 9, Issue 4, 1999, Pages 241-248

  Lu, Daoqiang ^a   Wong, David ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; ADHESIVES; AGENTS; CONDUCTIVE FILMS; CORROSION INHIBITORS; CURING; ENVIRONMENTAL IMPACT; EPOXY RESINS; INTERFACES (MATERIALS); PLASTICS FILLERS; SOLDERING ALLOYS; THERMAL EXPANSION;

CURING AGENTS; ELECTRICALLY CONDUCTIVE ADHESIVES;

ELECTRONICS PACKAGING;

EID: 0033292539     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313199000167     Document Type: Article

References (17)

1. D. Lu, Q. Tong, and C. P. Wong, "A fundamental study on silver flakes for conductive adhesives", 1998 International Symposium on Advanced Packaging Materials, Braselton, GA (1998), pp. 256-260.
2. P. G. Harris, "Conductive adhesives: A critical review of progress to date", Soldering & Surface Mount Technology 20 (1995), 19-21.
3. K. Gilleo, "Assembly with conductive adhesives", Soldering & Surface Mount Technology 19 (1995), 12-17.
4. J. C. Jagt, "Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art", IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A 21(2) (1998), 215-225.
5. A. O. Ogunjimi, O. Boyle, D. C. Whalley and D. J. Williams, "A review of the impact of conductive adhesive technology on interconnection", J. Electronics Manufacturing 2 (1992) 109-118.
6. J. Liu, Z. Lai, H. Kristiansen and C. Khoo, "Overview of conductive adhesive joining technology in electronics packaging applications", Proceedings of the 3rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton, New York (1998), pp. 1-17.
7. S. Corbett and M. J. Dominano, "Processing with polymer solders", Surface Mount Technology 11(6) (1997), 48-52.
8. G. Nguyen, J. Williams and F. Gibson, "Conductive adhesives: Reliable and economical alternatives to solder paste for electrical applications," ISHM Proceedings (1992), pp. 510-517.
9. D. Lu, Q. K. Tong and C. P. Wong, "Mechanisms underlying the unstable contact resistance of conductive adhesives", Proceedings of the 49th Electronic Components and Technology Conference, Part C 22(3) (1999), 228-232.
10. R. L. Keusseyan, J. L. Dilday and B. S. Speck, "Electric contact phenomena in conductive adhesive interconnections", International Journal of Microcircuits and Electronic Packaging 17(3) (1994), 236-42.
11. Bryan Ellis, Chemistry and Technology of Epoxy Resins, Blackie Academic & Professional, New York, 1993, p. 40.
12. D. Lu and C. P. Wong, "Conductive adhesives based on anhydride-cured epoxy systems", Proceedings of 2nd International IEEE Symposium on Polymeric Electronics Packaging (1999), pp. 27-34.
13. Q. K. Tong, G. Fredrickson, R. Kuder and D. Lu, "Conductive adhesives with superior impact resistance and stable contact resistance", Proceedings of the 49th Electronic Components and Technology Conference (1999), pp. 347-352.
14. M. Zwolinski, J. Hickman, H. Rubon and Y. Zaks, "Electrically conductive adhesives for surface mount solder replacement", Proceedings of the 2nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing Stockholm, Sweden, (1996), pp. 333-340.
15. D. Lu and C. P. Wong, "Conductive adhesives with improved properties", Proceedings of the 2nd International IEEE Symposium on Polymeric Electronics Packaging (1999), pp. 1-8.
16. J. Liu et al., "Surface characteristics, reliability and failure mechanisms of tin, copper and gold metallizations", Proceedings of the 2nd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Stockholm, Sweden, (1996), p. 141.
17. Q. Tong, A. Xiao and D. Lu, Conductive and Resistive Materials with Electrical Stability for Use in Electronics Devices, US patent, filed in March 1999.