Study of crystal orientation in Cu film on TiN layered structures

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 4, 1999, Pages 1464-1469

  Abe, Kazuhide ^a  

^a OKI ELECTRIC INDUSTRY CO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22644451889     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590775     Document Type: Article

References (10)

1. H-K. Kong, J. S. H. Cho, I. Asano, and S. S. Wong, Proceedings of the VLSI Multilevel Interconnection Conference, Santa Clara, 1992, pp. 337-343.
2. J. Tao, N. W. Cheung, and C. Hu, IEEE Electron Device Lett. 14, 249 (1993).
3. S. Vaidya and A. K. Sinha, Thin Solid Films 75, 253 (1981).
4. K. Hinode and Y. Homma, Proceedings of the 28th IEEE International Reliability Physics Symposium, Las Vegas, 1990, pp. 25-30.
5. H. Shibata, M. Murota, and K. Hashimoto, Jpn. J. Appl. Phys., Part 1 32, 4479 (1993).
6. H. Toyoda, T. Kawanoue, M. Hasunuma, H. Kaneko, and M. Miyauchi, Proceedings of the 32nd IEEE International Reliability Physics Symposium, San Jose, 1994, pp. 178-184.
7. H. Onoda, T. Narita, K. Touchi, and K. Hashimoto, Proceedings of the 34th IEEE International Reliability Physics Symposium, Dallas, 1996, pp. 139-147.
8. M. Kageyama, K. Hashimoto, and H. Onoda, Proceedings of the 29th IEEE International Reliability Physics Symposium, Las Vegas, 1991, pp. 97-102.
9. K. Abe, Y. Harada, and H. Onoda, Appl. Phys. Lett. 71, 2782 (1997).
10. K. Abe, Y. Harada, and H. Onoda, Proceedings of the 36th IEEE International Reliability Physics Symposium, Reno, 1998, pp. 342-347.