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Status and outlook for ArF immersion lithography
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Aug. 2-5, Vancouver, Canada
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Understanding the photoresist surface-liquid interface
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Topcoats for 193 nm immersion resists
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Simulation of the effect of a resist-surface bound air bubble on imaging in immersion lithography
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A methodology for the characterization of topography inducedimmersion bubble defects
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Impact of water and top-coats on lithographic performance in 193-nm immersion lithography
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S. Kishimura, R. Gronheid, M. Ercken, M. Maenhoudt, T. Matsuo, M. Endo, M. Sasago, Impact of water and top-coats on lithographic performance in 193-nm immersion lithography, Proceedings of SPIE 5753-04 (2005).
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Resist profile control in immersion lithography using scatterometry measurements
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I. Pollentier, M. Ercken, P. Foubert, S.Y. Cheng, Resist profile control in immersion lithography using scatterometry measurements, Proceedings of SPIE 5754-11 (2005).
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