A methodology for the characterization of topography induced immersion bubble defects

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5754, Issue PART 1, 2005, Pages 154-163

  Kocsis, Michael ^a,b,c   De Bisschop, Peter ^a   Maenhoudt, Mireille ^a   Kim, Young Chang ^a   Wells, Greg ^a,d   Light, Scott ^a,e   DiBiase, Tony ^f  

^a IMEC   (Belgium)

^b SEMATECH   (United States)

^c INTEL CORPORATION   (United States)

^d TEXAS INSTRUMENTS   (United States)

^e MICRON TECHNOLOGY INC   (United States)

^f KLA TENCOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR ENTRAINMENT; BUBBLES (IN FLUIDS); CHARACTERIZATION; DEFECTS; FLUID DYNAMICS; SILICON WAFERS; SURFACE TOPOGRAPHY;

DOSE MODULATION; IMMERSION FLUIDS; IMMERSION LITHOGRAPHY; SURFACE RESISTANCE;

PHOTOLITHOGRAPHY;

EID: 22144497694     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.599329     Document Type: Conference Paper

References (6)

1. Nellis, et al, Modeling Support for Immersion Lithography, Immersion Lithography Workshop, January 2004
2. Donders, et al, Bubble investigation for Immersion Lithography, Immersion Lithography Workshop, August 2004
3. Sematech Statement of Work, Lithographic Tests for Immersion Defects, May 2004
4. Yeung, Simulation of printability of nano- and micro-bubbles in liquid immersion lithography, Immersion Lithography Workshop, July 2003
5. Kocsis, et al, Experimental Characterization of Topography Induced Immersion Bubble Defects, Immersion Lithography Workshop, August 2004
6. De Bisschop, et al, Simulation of the effect of a resist-surface bound air bubble on imaging in immersion lithography, Optical Mircolithography XVIII, Proceedings of SPIE, Vol 5754 (2005)