Analytical extraction of thermal conductivities of low k dielectrics for advanced technologies

IEEE International Integrated Reliability Workshop Final Report

Volumn , Issue , 2004, Pages 52-58

  Ney, D ^a   Girault, V ^a   Federspiel, X ^b  

^a STMICROELECTRONICS   (France)

^b CRandD labs   (France)

Author keywords

Copper interconnects; Dissipated power; Electromigration; IMD; Joule heating; Oxide; Thermal conductivity

Indexed keywords

COPPER; ELECTRIC CURRENTS; ELECTROMIGRATION; EMBEDDED SYSTEMS; ERROR ANALYSIS; FINITE ELEMENT METHOD; FUSED SILICA; GLASS; HEAT RESISTANCE; INTEGRATED CIRCUITS; RELIABILITY; SILICA; SILICON CARBIDE; THERMAL CONDUCTIVITY;

COPPER INTERCONNECTS; DISSIPATED POWER; INTER METAL DIELECTRICS (IMD); JOULE HEATING; SILICATE CARBIDE OXIDE (SIOCH);

DIELECTRIC MATERIALS;

EID: 21644484113     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. J.C. Lambropoulos et al., "Thermal conductivity of dielectrics thin films", J. Appl. Phys., 1989, Vol. 66, n°9, pp. 4230-4242
2. H. Schafft et al., "Thermal conductivity measurements of thin film silicon dioxide", in Proc. of the Conf. on Microelec. Test Structures, 1989, Vol.2, n° 1, p. 121
3. J. Gill et al., "Predicting Thermal Behavior of Interconnect", IRW Final Report, 1999, pp. 54-60
4. F. Chen et al., "Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics", in IRPS Proc., 2004, pp. 68-73
5. M. Von Arx, "Process-Dependent thin film thermal conductivities for thermal CMOS MEMS", J. Microelectromech. Syst., 1999, Vol. 9, pp. 136-145
6. AA. Bilotti, "Static temperature distribution in IC chips isothermal heat source", 1974, Vol. 21, pp. 217-226
7. L. Arnaud, ULISSE, http://www-leti.cea.fr/commun/europe/ulisse/Del26-02123.pdf, 2003