Impact of electroplated copper thickness on copper CMP and Cu/Coral™ BEOL integration

Microelectronic Engineering

Volumn 81, Issue 1, 2005, Pages 66-74

  Seah, C H ^a   You, G Z ^a   Wang, S R ^a   Li, C Y ^a   Kumar, R ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Copper CMP; Electroplated copper

Indexed keywords

ANNEALING; CHEMICAL MECHANICAL POLISHING; DIELECTRIC MATERIALS; ELECTRIC FIELD EFFECTS; ELECTROCHEMISTRY; ELECTROPLATING; MORPHOLOGY;

ELECTRICAL TESTS; ELECTROCHEMICAL PLATED (ECP); ELECTROPLATED COPPER; SELF-IONIZED METAL PLASMA (SIP);

COPPER;

EID: 21644458953     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.03.040     Document Type: Article

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