Fluxless Sn-Bi-Au bonding process using multilayer design

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 486-488

  Choe, S ^a   Chuang, R ^a   Lee, C C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; FIBER OPTICS; MECHANICAL PROPERTIES; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; MULTILAYERS; OPTOELECTRONIC DEVICES; OXIDATION; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; TIN ALLOYS;

FLUXLESS TIN BISMUTH GOLD BONDING; LEAD-FREE SOLDER;

SOLDERING ALLOYS;

EID: 0034822222     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Eutectic Sn-Bi as an alternative to Pb-free solders
2. High volume capable direct chip attachment methods
3. A new bonding technology using gold and tin multilayer composite structures
4. Advances in bonding technology for electronic packaging
5. Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock