Thin layer acoustic image interpretation and metrology for microelectronics using a broadband model

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 2, 2005, Pages 353-365

  Canumalla, Sridhar ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

Acoustic microscopy; Metrology; Pulse distortion and delamination; Pulsed ultrasound; Thin layers

Indexed keywords

ACOUSTIC MICROSCOPES; ACOUSTIC VARIABLES MEASUREMENT; BONDING; CRACKS; DELAMINATION; ELECTRONICS PACKAGING; FREQUENCY DOMAIN ANALYSIS; IMAGE ANALYSIS; INTERFACES (MATERIALS); MATHEMATICAL MODELS;

FOREIGN MATERIALS; MOISTURE INGRESS; PULSE DISTORTION; PULSED ULTRASOUND; THIN LAYER ACOUSTIC IMAGE INTERPRETATION;

MICROELECTRONICS;

EID: 21044452211     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848496     Document Type: Article

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