Resolution of broadband transducers in acoustic microscopy of encapsulated ICs: Transducer selection

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 4, 1999, Pages 582-592

  Canumalla, Sridhar ^a  

^a Sonoscan Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC FIELD MEASUREMENT; ELECTROMAGNETIC WAVE ATTENUATION; ELECTRONICS PACKAGING; ENCAPSULATION; FUNCTIONS; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; MICROSCOPIC EXAMINATION; PLASTICS MOLDING;

BROADBAND TRANSDUCERS; PLASTIC QUAD FLAT PACKAGES (PQFP);

ULTRASONIC TRANSDUCERS;

EID: 0033338107     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.814975     Document Type: Article

References (6)

1. R. S. Gilmore Industrial ultrasonic imaging and microscopy J. Phys. D: Appl. Phys.. vol. 29 pp. 1389-1417 1996.
2. J. Ophir and P. Jaeger Spectral shifts of ultrasonic propagation through media with nonlinear dispersive attenuation Ultrason. Imag. vol. 4 pp. 282-289 1982.
3. G. S. Kino Acoustic Waves: Devices Imaging and Analog Signal Processing. New York: Prentice-Hall 1987.
4. S. Canumalla and L. W. Kessler Toward a nondestructive procedure for characterization of molding compounds in Proc. Int. Ret. Phys. Symp. Denver CO 1997 pp. 149-155.
5. A. Papoulis Systems and Transforms with Applications in Optics. New York: McGraw-Hill 1968.
6. L. Bechou Y. Ousten B. Tregon F. Marc Y. Danto R. Even and P. Kertecz Ultrasonic images interpretation improvement for microassembling technologies characterization Microelectron. ReL vol. 37 no. (10/11) pp. 1787-1790 1997.