Boundary-free multi-element barrier films by reactive co-sputtering

Surface and Coatings Technology

Volumn 198, Issue 1-3 SPEC. ISS., 2005, Pages 335-339

  Hsieh, J H ^a   Li, C ^a   Wang, C M ^a   Tang, Z Z ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Amorphous; Co sputtering; Diffusion barrier; Ta Cr; Ta Cr N

Indexed keywords

AMORPHIZATION; CHROMIUM; MORPHOLOGY; NITROGEN; SCANNING ELECTRON MICROSCOPY; SILICON; TANTALUM ALLOYS; TERNARY SYSTEMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

AMORPHOUS STRUCTURES; BARRIER PROPERTY; FOUR-POINT PROBES; MULTI-ELEMENT BARRIER FILMS;

THIN FILMS;

SPUTTERING;

EID: 20744458729     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2004.10.116     Document Type: Article

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