Localized electrochemical deposition of copper monitored using real-time X-ray microradiography

Advanced Functional Materials

Volumn 15, Issue 6, 2005, Pages 934-937

  Seol, Seung Kwon ^a   Pyun, Ah Ram ^a   Hwu, Yeukuang ^b   Margaritondo, Giorgio ^c   Je, Jung Ho ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

^b INSTITUTE OF PHYSICS   (Taiwan)

^c EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ANODES; ASPECT RATIO; COPPER; ELECTROCHEMISTRY; GROWTH (MATERIALS); IONS; MICROSTRUCTURE; POROSITY; X RAY RADIOGRAPHY;

ELECTROCHEMICAL DEPOSITION; LATERAL RESOLUTION; METAL STRUCTURE; MICRORADIOGRAPHY;

ELECTRODEPOSITION;

EID: 20544468493     PISSN: 1616301X     EISSN: None     Source Type: Journal    
DOI: 10.1002/adfm.200400514     Document Type: Article

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10. The time dependence of the current and the deposition rate correlate with each other, supporting our analysis based on the interplay of migration and diffusion. One might argue that convection effects caused by the oxygen bubbles could also play a role. We note, however, that the oxygen bubble diameter is always larger than L, as demonstrated by Figures 1a,b. Thus, convection effects do not change with L in the relevant range of L-values.
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