Temperature-compensated film bulk acoustic resonator above 2 GHz

IEEE Electron Device Letters

Volumn 26, Issue 6, 2005, Pages 369-371

  Pang, Wei ^a   Yu, Hongyu ^a   Zhang, Hao ^a   Kim, Eun Sok ^a  

^a University of Southern California ^*  (United States)

Author keywords

Air gap capacitor; Film bulk acoustic resonators (FBARs); Surface micromaching; Temperature compensation; XeF2

Indexed keywords

ALUMINUM NITRIDE; CAPACITORS; EQUIVALENT CIRCUITS; FILMS; MATHEMATICAL MODELS; MEASUREMENTS; MICROMACHINING; SILICA; THERMAL EFFECTS; ZINC OXIDE;

AIR GAP CAPACITOR; FILM BULK ACOUSTIC RESONATORS (FBARS); SURFACE MICROMACHINING; TEMPERATURE COMPENSATION;

ACOUSTIC RESONATORS;

EID: 20544453622     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2005.848113     Document Type: Article

References (10)

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