Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 2, 2005, Pages 328-336

  Yin, Wen Yan ^a   Dong, X T ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Average power handling capability (APHC); Loss tangent; Microstrip interconnects (MIs); Ohmic attenuation constant; Polyimide; Thermal conductivity

Indexed keywords

DIELECTRIC MATERIALS; MICROSTRIP DEVICES; NUMERICAL METHODS; POLYIMIDES; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES; THERMAL CONDUCTIVITY;

AVERAGE POWER HANDLING CAPABILITY (APHC); LOSS TANGENT; MICROSTRIP INTERCONNECTS (MIS); OHMIC ATTENUATION CONSTANT;

ELECTRONICS PACKAGING;

EID: 20344367507     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.847898     Document Type: Article

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