Average power-handling capability of the signal line in coplanar waveguides on polyimide and GaAs substrates including the irregular line edge shape effects

International Journal of RF and Microwave Computer-Aided Engineering

Volumn 15, Issue 2, 2005, Pages 156-163

  Yin, Wen Yan ^a   Zhang, Yaojiang ^b   Dong, Xiaoting ^a   Gan, Yeow Beng ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

Author keywords

Attenuation; Average power handling capability (APHC); Distributed parameters; Finite ground coplanar waveguides (FGCPWs); Polyimide and GaAs; Thermal model

Indexed keywords

AVERAGE POWER HANDLING CAPABILITY (APHC); DISTRIBUTED PARAMETERS; FINITE-GROUND COPLANAR WAVEGUIDES (FGCPW); THERMAL MODELS;

ELECTROMAGNETIC WAVE ATTENUATION; ELECTROMAGNETISM; POLYIMIDES; SEMICONDUCTING GALLIUM ARSENIDE; SIGNAL PROCESSING; SILICA; SILICON; WAVEGUIDES;

MICROSTRIP LINES;

EID: 17444367708     PISSN: 10964290     EISSN: None     Source Type: Journal    
DOI: 10.1002/mmce.20063     Document Type: Article

References (14)

1. K.C. Gupta, R. Garg, I. Bahl, and P. Bhartia, Microstrip lines and slotlines, Artech House, Boston, 1996.
2. G.E. Ponchak, A. Margomenos, and L.P.B. Katehi, Low-loss, finite-width ground-plane, thin-film microstrip lines on Si wafers, Silicon Monolithic Integrated Circuits in RF Systems (2000), 43-47.
3. W. Heinrich, Quasi-TEM description of MMIC coplanar lines including conductor loss effects, IEEE Trans Microwave Theory Tech MTT-41 (1993), 45-52.
4. C.L. Hollowy and E.F. Kuester, A quasi-closed form expression for the coplanar loss of CPW lines, with an investigation of edge shape effects, IEEE Trans Microwave Theory Tech MTT-43 (1995), 2695-2701.
5. F. Schnieder, T. Tischler, and W. Heinrich, Modeling dispersion and radiation characteristics of conductor-backed CPW with finite ground width, IEEE Trans Microwave Theory Tech MTT-51 (2003), 137-143.
6. W.Y. Yin, B. Guo, and X.T. Dong, Pulse wave propagation in coplanar waveguides (CPWs) on LTCC substrates, Microwave Opt Technol Lett 37 (2003), 32-34.
7. W.Y. Yin, B. Guo, X.T. Dong, and Y.B. Gan, Lossy effects on the transient propagation in LTCC coplanar waveguides, Microwave Opt Technol Lett 39 (2003), 94-97.
8. W.Y. Yin, S.J. Pan, L.W. Li, and Y.B. Gan, Model description and parameter extraction of on-chip spiral inductors for MMIC's, Int J RF and Microwave CAE 14(2004), 111-121.
9. S.J. Pan, W.Y. Yin, and L.W. Li, Comparative investigation on various on-chip center-tapped interleaved transformers, Int J RF and Microwave CAE 15 (2004), 424-432.
10. I.J. Bahl, Average power handling capability of multilayer microstrip lines, Int J RF and Microwave CAE 11 (2001), 385-395.
11. W.Y. Yin, X.T. Dong, and Y.B. Gan, Frequency-dependent maximum average power handling capability of an edge-coupled microstrip lines on LTCC substrates, Int J RF and Microwave CAE 15 (2005), (accepted for publication).
12. G.E. Ponchak, M. Matloubian, and L.P.B. Katehi, A measurement-based design equation for the attenuation of MMIC-compatible coplanar waveguides, IEEE Trans Microwave Theory Tech MTT-47 (1999), 241-243.
13. J.K. Wee, Y.J. Park, H.S. Min, D.H. Cho, M.H. Seung, and H.S. Park, Modeling the substrate effect in interconnect line characteristics of high-speed VLSI circuits, IEEE Trans Microwave Theory Tech MTT-46 (1998), 1436-1443.
14. F. Stellari and A.L. Lacaita, New formulas of interconnect capacitances based on results of conformai mapping method, IEEE Trans Electron Dev 47 (2000), 222-231.