Bulk-alloy microstructural analogues for transient liquid-phase bonds in the NiAl/Cu/Ni system

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 30, Issue 12, 1999, Pages 3111-3124

  Gale, W F ^a   Abdo, Z A M ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; METALLOGRAPHIC MICROSTRUCTURE; NICKEL; NICKEL ALLOYS; PHASE TRANSITIONS; TRANSMISSION ELECTRON MICROSCOPY;

NICKEL ALUMINIDE; TRANSIENT LIQUID-PHASE (TLP) BONDING;

DISSIMILAR METALS;

EID: 0033346827     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-999-0222-6     Document Type: Article

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