A computational study on solder bump geometry, normal, restoring, and fillet forces during solder reflow in the presence of liquefied underfill

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 25, Issue 4, 2002, Pages 308-317

  Zhang, Yun ^a   Zhao, Renzhe ^b   Harris, Daniel K ^b   Johnson, R Wayne ^b  

^a AGERE SYSTEMS   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

Fillet forces; Flip chip; Reflow; Solder bump; Surface evolver; Underfill

Indexed keywords

FLIP CHIP DEVICES; MATHEMATICAL MODELS; MECHANICAL PROPERTIES; REGRESSION ANALYSIS; SOLDERING ALLOYS; SURFACE TENSION; WELDS; WETTING;

FILLET FORCES; LIQUEFIED UNDERFILL; SOLDER BUMP; SOLDER REFLOW;

ELECTRONICS PACKAGING;

EID: 0036826623     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2002.801371     Document Type: Article

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