Stencil printing on bumped wafer for pre-applied underfill application

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 775-779

  Tang, Hao ^a   Shi, Gary ^a   Crane, Larry ^a   Todd, Michael ^a   Carson, George ^a  

^a HENKEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT CHIP ATTACH (DCA); ELECTRONICS ASSEMBLERS; UNDERFILL COATING; UNDERFILL MATERIALS;

ELECTRONICS INDUSTRY; FLIP CHIP DEVICES; PRINTING; SOLDERED JOINTS; THERMAL EXPANSION; VISCOSITY;

CHIP SCALE PACKAGES;

ELECTRONICS; SOLDERING; STENCIL PRINTING; THERMAL EXPANSION; VISCOSITY;

EID: 10444251716     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. th Electronic Components and Technology Conf., San Diego, CA, May. 2002, pp. 1380-1384.