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Volumn 5, Issue 3, 2005, Pages 446-454

Combined differential and static pressure sensor based on a double-bridged structure

Author keywords

Combined pressure sensors; Double bridge; Finite element (FE); Microelectromechanical system (MEMS); O ring; Piezoresistive; Silicon; Stress; Wheatstone

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROPROCESSOR CHIPS; OPTIMIZATION; PIEZOELECTRIC DEVICES; SILICON; SILICON WAFERS; STRESS ANALYSIS;

EID: 19944403578     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2005.845199     Document Type: Article
Times cited : (24)

References (12)
  • 2
    • 19944410228 scopus 로고    scopus 로고
    • Highly reliable O-ring packaging concept for MEMS pressure sensors
    • to be published
    • _, "Highly reliable O-ring packaging concept for MEMS pressure sensors," Sens. Actuators A, to be published.
    • Sens. Actuators A
  • 3
    • 19944410576 scopus 로고    scopus 로고
    • "Pressure sensor or differential pressure sensor," European Patent EP00 801 293B1
    • N. D. Jensen, K. Dyrbye, T. R. Brown, and P. E. Andersen, "Pressure sensor or differential pressure sensor," European Patent EP00 801 293B1, 1997.
    • (1997)
    • Jensen, N.D.1    Dyrbye, K.2    Brown, T.R.3    Andersen, P.E.4
  • 7
    • 0026881945 scopus 로고
    • Température compensation of piezoresistive pressure sensors
    • M. Akbar and M. A. Shanblatt, "Température compensation of piezoresistive pressure sensors," Sens. Actuators A, vol. 33, pp. 155-162, 1992.
    • (1992) Sens. Actuators A , vol.33 , pp. 155-162
    • Akbar, M.1    Shanblatt, M.A.2
  • 9
    • 0029510971 scopus 로고
    • Compensation method of offset and its temperature drift in silicon piezoresistive pressure sensor using double Wheatstone-bridge configuration
    • Stockholm, Sweden
    • Y.-T. Lee and H.-D. Seo, "Compensation method of offset and its temperature drift in silicon piezoresistive pressure sensor using double Wheatstone-bridge configuration," in Proc. 8th Int. Conf. Solid-State Sensors and Actuators and Eurosensors IX, Stockholm, Sweden, 1995, pp. 570-573.
    • (1995) Proc. 8th Int. Conf. Solid-State Sensors and Actuators and Eurosensors IX , pp. 570-573
    • Lee, Y.-T.1    Seo, H.-D.2
  • 10
    • 19944411561 scopus 로고
    • "Semiconductor pressure transducer," U.S. Patent US04 530 244
    • J. B. Starr, "Semiconductor pressure transducer," U.S. Patent US04 530 244, 1984.
    • (1984)
    • Starr, J.B.1
  • 11
    • 19944424211 scopus 로고    scopus 로고
    • Properties of Silicon, Inspec, 1988
    • Properties of Silicon, Inspec, 1988.
  • 12
    • 0032050258 scopus 로고    scopus 로고
    • Effect of contact pressure and thermal degradation on the sealability of O-ring
    • K. Yokoyama, M. Okazaki, and T. Komito, "Effect of contact pressure and thermal degradation on the sealability of O-ring," JSAE Rev., vol. 19, pp. 123-128, 1998.
    • (1998) JSAE Rev. , vol.19 , pp. 123-128
    • Yokoyama, K.1    Okazaki, M.2    Komito, T.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.