A new atomic layer deposition of W-N thin films

Physica Status Solidi (A) Applied Research

Volumn 201, Issue 13, 2004, Pages

  Sim, Hyun Sang ^a   Park, Ji Ho ^a   Kim, Yong Tae ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIA; AMORPHOUS MATERIALS; CHEMICAL MECHANICAL POLISHING; CHEMICAL VAPOR DEPOSITION; ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; NANOSTRUCTURED MATERIALS; SILICA; THERMODYNAMIC STABILITY; TUNGSTEN COMPOUNDS; ULSI CIRCUITS;

ATOMIC LAYER DEPOSITION (ALD); DIFFUSION BARRIERS; INTERLAYER MATERIALS; MULTI-LEVEL INTERCONNECTION;

THIN FILMS;

EID: 19644393871     PISSN: 00318965     EISSN: None     Source Type: Journal    
DOI: 10.1002/pssa.200409066     Document Type: Article

References (11)

1. H. P. Kattelus, E. Kolawa, K. Affolter, and M.-A. Nicolet, J. Vac. Sci. Technol. A 3, 2246 (1985).
2. J. O. Olowolafe, J. Li, J. W. Mayer, and E. G. Colgan, Appl. Phys. Lett. 58, 469 (1991).
3. E. Kolawa, J. S. Reid, P. J. Pokela, and M.-A. Nicolet, J. Appl. Phys. 70, 1369 (1991).
4. Y. T. Kim, C. S. Kwon, D. J. Kim, J. W. Park, and C. W. Lee, J. Vac. Sci. Technol. A16, 477 (1998).
5. D. J. Kim, H. S. Sim, S. Lee, Y. T. Kim, S.-I. Kim, and J. W. Park, Jpn. J. Appl. Phys. 40, 1214 (2001).
6. J. W. Klaus. S. J. Ferro, and S. M. George. J. Electrochem. Soc. 147, 1175 (2000).
7. J. S. Becker and R. G. Gordon, Appl. Phys. Lett. 82, 2239 (2003).
8. H. S. Sim, S.-I. Kim, and Y. T. Kim, J. Vac. Sci. Technol. B 21, 1411 (2003).
9. T. Nakajima, K. Watanabe, and N. Watanabe, J. Electrochem. Soc. 134, 3175 (1987).
10. J. R. Creighton, J. Electrochem. Soc. 136(1), 271 (1989).
11. H. S. Sim, Y. T. Kim, and H. Jeon, Jpn. J. Appl. Phys. 42, 6359 (2003).