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Volumn 389-393, Issue , 2002, Pages 879-884
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Ohmic contact structure and fabrication process applicable to practical SiC devices
a,c a,c a,c b,c |
Author keywords
4H SiC; A SiC; Contact; Contact annealing; Contact resistance
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Indexed keywords
CONTACT RESISTANCE;
CONTACTS (FLUID MECHANICS);
FABRICATION;
OHMIC CONTACTS;
TITANIUM OXIDES;
ION IMPLANTATION;
RAPID THERMAL ANNEALING;
SILICON CARBIDE;
4H-SIC;
4H-SIC SUBSTRATE;
CONTACT MATERIAL;
CONTACT STRUCTURE;
CONVENTIONAL TECHNIQUES;
FABRICATION PROCESS;
FIELD OXIDES;
SPECIFIC CONTACT RESISTANCES;
SILICON CARBIDE;
SEMICONDUCTOR DEVICES;
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EID: 18844473170
PISSN: 02555476
EISSN: 16629752
Source Type: Book Series
DOI: 10.4028/www.scientific.net/MSF.389-393.879 Document Type: Conference Paper |
Times cited : (36)
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References (8)
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