Ku-band MMiC’s in low-cost, SMT compatible packages

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2002, Pages 27-30

  Huang, Ho C ^a   Ezzeddine, Amin ^a   Darwish, Ali ^a   Hsu, Becker ^a   Williams, Jim ^b   Peak, Steve ^b  

^a AMCOM Communications Inc   (United States)

^b Technovative Applications   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; COMPUTER SIMULATION; ELECTRONICS PACKAGING; HEAT RESISTANCE; HIGH ELECTRON MOBILITY TRANSISTORS; INTEGRATED CIRCUIT LAYOUT; MILLIMETER WAVES; POWER AMPLIFIERS; SURFACE MOUNT TECHNOLOGY; WAVEGUIDE COMPONENTS;

LOW NOISE AMPLIFIER; METALIZATION PATTERN; MILLIMETER WAVE COMPONENTS; NOISE FIGURE; POINT TO POINT RADIO; RETURN LOSS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0036077167     PISSN: 0149645X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MWSYM.2002.1011550     Document Type: Article

References (5)

1. Development of a millimeter-wave system-on-a-package utilizing MCM integration
2. Development of a 36 GHz millimeter-wave BGA package
3. Self-packaged millimeter-wave Si-IMPATT diodes
4. Thermally optimised millimeter wave package on an LTCC ceramic board
5. A wideband CPW-to-microstrip transition for millimeter-wave packaging