Microwave and millimeterwave transceivers for radio links and LMDS communications - The challenge for technology and packaging strategy

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4428, Issue , 2001, Pages 143-148

  Oppermann, M ^a  

^a AIRBUS GROUP INNOVATIONS   (Germany)

Author keywords

Future electronics and materials; High frequency packaging; Strategies; Technology trends roadmap

Indexed keywords

MICROWAVE LINKS; RELIABILITY; SPECTRUM ANALYSIS; TECHNOLOGICAL FORECASTING; TRANSCEIVERS;

HIGH FREQUENCY PACKAGING; LOCAL MULTIPOINT COMMUNICATION SYSTEM; LOCAL MULTIPOINT DISTRIBUTION SYSTEM; MILLIMETERWAVE TRANSCEIVERS;

ELECTRONICS PACKAGING;

EID: 0034823342     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Broadband wireless communication systems: Influence of architectures and packaging concepts of mm-wave frontends on time-to-market and cost
2. A review of flip-chip GaAs circuits, models, interconnection and modelling technique in use at Marconi