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Volumn 3, Issue , 1999, Pages 958-961
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Surface mount package for high frequency band
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC MATERIALS;
COST EFFECTIVENESS;
ELECTRONICS PACKAGING;
INSERTION LOSSES;
MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;
MULTILAYERS;
SURFACE MOUNT TECHNOLOGY;
MINIATURIZATION;
SURFACE MOUNT TECHNOLOGY;
COST EFFECTIVENESS;
CERAMICS STRUCTURE;
COST EFFECTIVE;
DESIGN TECHNOLOGIES;
FEED THROUGH;
HIGH FREQUENCY BANDS;
MULTILAYER CERAMICS;
SURFACE MOUNT PACKAGE;
VIA HOLE;
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EID: 0033327337
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (5)
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References (0)
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