A microstrip-to-microstrip hot-via transition up-to 80 GHz designed for direct PCB mounting of MMICs

Conference Proceedings- European Microwave Conference

Volumn 2, Issue , 2004, Pages 653-656

  Saboureau, Cédrick ^a   Baillargeat, D ^a   Verdeyme, S ^a   Bessemoulin, A ^b   Bois, J R ^b   Quentin, P ^b  

^a UNIVERSITY OF LIMOGES   (France)

^b U Monolithic Semiconductors SAS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND NETWORKS; CHIP SCALE PACKAGES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY; TELECOMMUNICATION SYSTEMS;

BROADBAND TRANSITION; HOT-VIA TRANSITION; RADIO FREQUENCY (RF) SIGNALS; W-BAND;

MICROSTRIP DEVICES;

EID: 18744413607     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. K. Beilenhoff, A. Bessemoulin, P. Quentin, al., "Full 26-GHz MMIC chipset for telecom applications in SMD type packages" GAAS 2002, pp. 331-334, Italy, Sept 2002.
2. A. Bessemoulin, C. Gaessler, P. Marschall, P. Quentin, "A chip-scale package amplifier MMIC using broadband Hot-Via transitions" GAAS 2003, Munich, Germany
3. T.E. Kazior, H. N. Atkins, al., "DBIT - Direct Backside Interconnect Technology: A manufacturable, bond-wire free interconnect technology for microwave and millimetre wave MMICs" IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, pp. 723-726, June 1997.
4. P. Quentin, "Procédé d'interconnexion entre un circuit intégré et un support, et circuit intégré adapté à ce procédé" Thomson-CSF French patent n°2 665 574, U.S. Patent n° 5 158 911, July 1990.
5. S. Verdeyme, V. Madrangeas, D. Cros, M. Aubourg, P. Guillon, "Design of microwave devices using the finite element method", Workshop on Global EM Analysis of microwave circuits, IMS 1996, San Francisco, 17-21 June 1996.
6. F.J. Schmückle, A. Jentzsch, C. Gässler, P. Marschall, al. "40GHz Hot-Via flip-chip interconnects" IEEE MTT-S Int. Microwave Symp. Dig., pp. 1167-1170, June 2003.
7. T. Tischler, M. Rudolph, A. KilK, W. Heinrich, "Via arrays for grounding in multilayer packaging frequency limits and design rules" IEEE MTT-S Int. Microwave Symp. Dig., pp. 1147-1150, June 2003.