Via arrays for grounding in multilayer packaging - Frequency limits and design rules

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2003, Pages 1147-1150

  Tischler, Thorsten ^a   Rudolph, Matthias ^a   Kilk, Andreas ^a   Heinrich, Wolfgang ^a  

^a LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETISM; EQUIVALENT CIRCUITS; SEMICONDUCTING GALLIUM ARSENIDE;

PARASITIC MODES;

MULTILAYERS;

EID: 0041591200     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. W. Chapell, L. Katehi, "High Frequency Applications for Two-Dimensional Periodic Substrate," 2002 European Microwave Conference Dig., vol. 1, pp. 21-24.
2. B. R. Allen, "Cost Effective Millimeter-Wave Packaging," IEEE MTT-S Int. Microwave Symp.Workshop Notes, Highly Integrated Packaging Techniques, WSB, June 2002.
3. W. H. Haydl, "On the Use of Vias in Conductor-Backed Coplanar Circuits," IEEE Trans. Microwave Theory Tech., vol. 50, 1571-1577, June 2002.