Thermal design and optimization methodology for integrated power electronics modules

Journal of Electronic Packaging

Volumn 127, Issue 1, 2005, Pages 59-66

  Pang, Ying Feng ^a   Scott, Elaine P ^a   Chen, Jonah Zhou ^a   Thole, Karen A ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

Integrated Design Optimization; Integrated Power Electronic Module; Thermal Analysis

Indexed keywords

COMPUTER SOFTWARE; COPPER; ELECTRIC CURRENTS; INTEGRATED CIRCUITS; OPTIMIZATION; PRODUCT DESIGN; THERMOANALYSIS;

INTEGRATED DESIGN OPTIMIZATION; INTEGRATED POWER ELECTRONIC MODULE; THERMAL DESIGN; VOLTAGE SPIKE;

ELECTRONIC EQUIPMENT;

EID: 18744413283     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1849233     Document Type: Article

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