Thermal characterization of DBC and MMC stacks for power modules

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 3, Issue , 1996, Pages 1411-1417

  Fusaro, James M ^a   Romero, Guillermo L ^a   Rodriguez, Pablo ^a   Martinez Jr , Joe L ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COMPUTER SIMULATION; COPPER; FINITE ELEMENT METHOD; INFILTRATION; METALLIC MATRIX COMPOSITES; MOLTEN MATERIALS; POROUS SILICON; SILICON CARBIDE;

HYBRID POWER MODULE OPERATION; MOLTEN ALUMINUM ALLOY; SILICON CARBIDE ALUMINUM COMPOSITE; THERMAL CHARACTERIZATION;

POWER ELECTRONICS;

EID: 0030421801     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)