Study of power module package structures

IWIPP 2000 - International Workshop on Integrated Power Packaging

Volumn , Issue , 2000, Pages 46-50

  Ohbu, Toshiharu ^a   Kodani, Kazuya ^a   Tada, Nobumitsu ^a   Matsumoto, Toshiaki ^a   Kijima, Kenji ^a   Saito, Suzuo ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BUSBARS; ELECTRIC POWER SYSTEMS; STRUCTURAL OPTIMIZATION;

CHIP LAYOUT; CHIP TEMPERATURE; CONTACT THERMAL RESISTANCE; HIGH CURRENTS; POWER MODULE; REDUCTION METHOD; STRAY INDUCTANCES; SURGE VOLTAGE;

CHIP SCALE PACKAGES;

EID: 0346281411     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IWIPP.2000.885180     Document Type: Conference Paper

References (2)

1. T.Ohbu et al, "Thermal Characteristic of Module Type Power Devices Mounted in The Inverter", IPEC-Tokyo2000, 2000.
2. KKodani et al, "Study of Terminal Structure inside Power Module Package", IPEC-Tokyo2000, 2000