Electrical-optical circuit boards with 4-channel butt-coupled optical transmitter and receiver modules

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4455, Issue , 2001, Pages 221-230

  Himmler, A ^a   Bargiel, S ^b   Ebling, F ^b   Schroder H ^b   Franke, H ^c   Spickermann, G ^c   Griese, E ^a   Lehnberger, C ^d   Oberender, L ^d   Koske, A ^e   Steck, D ^f   Strake, E ^g   Sullau W ^h  

^a SIEMENS AG   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c Coeca GMBH ^*  (Germany)

^d Andus Electronic GMBH   (Germany)

^e UNIVERSITY OF PADERBORN   (Germany)

^f Mikropack GmbH   (Germany)

^g ROBERT BOSCH GMBH   (Germany)

^h ILFA GmbH   (Germany)

Author keywords

Board integrated optical waveguides; Electrical optical circuit boards; Optical interconnects

Indexed keywords

INTEGRATION; OPTICAL INTERCONNECTS; OPTICAL WAVEGUIDES; PRINTED CIRCUIT BOARDS;

ELECTRICAL OPTICAL CIRCUIT BOARDS; OPTICAL RECEIVER MODULES; OPTICAL TRANSMITTER;

ELECTROOPTICAL DEVICES;

EID: 18644382037     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.450442     Document Type: Article

References (16)

1. Semiconductor Industry Association, San Jose/California (USA), International Technology Roadmap for Semiconductors, 1999 Edition and 2000 Update, 2000 and 2001.
2. R. Chau, "30nm and 20nm physical gate length CMOS transistors," in Proc. 2001 Silicon Nanoelectronics Workshop, (Kyoto, Japan), June 2001.
3. R. A. Nordin, W. R. Holland, and M. A. Shahid, "Advanced optical interconnection technology in switching equipment," Journal of Lightwave Technology 13, pp. 987-994, June 1995.
4. Q. Tan and J. Vandewege, "2.5Gb/s/mm optical fiber interconnections," in Proc. 22nd Eur. Conf. on Opt. Comm., pp. 2.55-2.58, (Oslo, Norway), 1996.
5. Y. S. Liu, J. Rowlette, Y. Liu, and A. Nahata, "High density optical interconnect for board and backplane applications using polymer waveguides and VCSEL array devices," in Proc. of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2), pp. 379-380, (Orlando, FL, USA), 1998.
6. B. Dhoedt, R. Baets, P. Van Daele, P. Heremans, J. Van Campenhout, J. Hall, R. Michalzik, A. and H. Thienpont, R. Vouckx, A. Neyer, D. C. O'Brien, and J. Van Koetsem, "Optically interconnected integrated circuits to solve the CMOS interconnect bottleneck," in Proc. of the 48th Electronic Components & Technology Conference, pp. 992-998, (Seattle, WA, USA), 1998.
7. M. Hibbs-Brenner, J. Lehman, Y. Liu, K. Johnson, R. Morgan, E. Strzelecka, and R. Skogman, "Packaging of VCSEL arrays for cost-effective interconnects at less than 10 meters," in Proc. of the 49th Electronic Components and Technology Conference, pp. 747-752, (San Diego, CA, USA). 1999.
8. Y. S. Liu, R. J. Wojnarowski, M. A. Hennessy, J. P. Bristow, Yue Liu, A. Peczalski, J. Rowlette, A. Plotts, J. Stack, M. Kadar-Kallen, J. Yardley, L. Eldada, R. M. Osgood, R. Scarmozzino, S. H. Lee, V. Osgus, and S. Patra, "Polymer optical interconnect technology (POINT) - optoelectronic packaging and interconnect for board and backplane applications," in Proc. of the IEEE 46th Electronic Components and Technology Conference (ECTC'96), pp. 308-315, 1996.
9. R. T. Chen, L. Wu, F. Li, S. Tang, M. Dubinovski, J. Qi, C. L. Schow, J. C. Campbell, R. Wickman, B. Picor, M. Hibbs-Brenner, J. Bristow, Y. S. Liu, S. Rattan, and C. Nodding, "Si CMOS process compatible guided wave multi-Gbit/sec optical clock signal distribution system for Cray T-90 supercomputer," in Proc. 1997 Massively Parallel Processing using Optical Interconnections MPPOI, pp. 10-24, Montreal (Canada), June 1997.
10. O. Krumpholz, R. Bogenberger, J. Guttmann, P. Huber, J. Moisel, and M. Rodel, "Optical backplane in planar technology," in Optoelectronic Interconnects VII; Photonics Packaging and Integration II, M. R. Feldman, R. L. Q. Li, W. B. Matkin, and S. Tang, eds., Proc. SPIE 3952, pp. 59-65, 2000.
11. E. Griese and A. Himmler, "Optical interconnections on high speed digital printed circuit boards," in Proceedings in Electromagnetic Research Symposium (PIERS), July 1997.
12. E. Griese, "Reducing EMC problems through an electrical/optical interconnection technology," IEEE Transactions on EMC 41, pp. 502-509, 1999.
13. E. Griese, D. Krabe, and E. Strake, "Electrical-optical printed circuit boards: Technology - design - modeling," in Interconnects in VLSI Design, H. Grabinski, ed., pp. 221-236, Kluwer Academic Publishers, Boston, 2000.
14. E. Griese, J. Gerling, T. Bierhoff, A. Wallrabenstein, A. Himmler, J. Schrage, and G. Mrozynski, "Modellierung und Simulation optischer Multimode-Verbindungen auf Leiterplatten," in To be published in: Kleinheubacher Berichte, vol. 45, 2001.
15. Semiconductor Industry Association, San Jose/California (USA), International Technology Roadmap for Semiconductors, 1997 Edition and 1998 Update, 1998 and 1999.
16. E. Griese, A. Himmler, K. Klinke, A. Koske, J.-R. Kropp, S. Lehmacher, A. Neyer, and W. Süllau, "Self-aligned coupling of optical transmitter and receiver modules to board-integrated optical multimode waveguides," Proc. SPIE 4455, 2001.