Packaging of VCSEL arrays for cost-effective interconnects at <10 meters

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 747-752

  Hibbs Brenner, Mary ^a   Lehman, John ^a   Liu, Yue ^a   Johnson, Klein ^a   Morgan, Robert ^a   Strzelecka, Eva ^a   Skogman, Richard ^a  

^a HONEYWELL TECHNOLOGY CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; COST EFFECTIVENESS; MULTICHIP MODULES; PHOTODETECTORS; SEMICONDUCTOR LASERS;

BLINDMATE CONNECTORS; VERTICAL CAVITY SURFACE EMITTING LASER;

ELECTRONICS PACKAGING;

EID: 0032638510     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)