Polymer optical interconnect technology (POINT)-optoelectronic packaging and interconnect for board and backplane applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 308-315

  Liu, Y S ^a   Wojnarowski, R J ^a   Hennessy, W A ^a   Bristow, J P ^a   Liu, Yue ^a   Peczalski, A ^a   Rowlette, J ^a   Plotts, A ^a   Stack, J ^a   Kadar Kallen, M ^a   Yardley, J ^a   Eldada, L ^a   Osgood, R M ^a   Scarmozzino, R ^a   Lee, S H ^a   et al , ^a  

^a GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; DATA COMMUNICATION SYSTEMS; DATA TRANSFER; ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; INTERACTIVE COMPUTER SYSTEMS; MULTICHIP MODULES; OPTICAL LINKS; OPTICAL WAVEGUIDES; SEMICONDUCTING POLYMERS; SWITCHING NETWORKS;

BACKPLANE INTERCONNECT; BOARD LEVEL INTERCONNECT; LOW COST DIFFRACTIVE OPTICAL ELEMENTS; MECHANICAL MODELING; MULTICHANNEL DATA TRANSMISSION; MULTIMODE OPTICAL WAVEGUIDE MODELING; OPTOELECTRONIC PACKAGING; POLYMER OPTICAL INTERCONNECT TECHNOLOGY; POLYMER WAVEGUIDE;

OPTICAL INTERCONNECTS;

EID: 0029718116     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)