Highly textured (111) electroless (EL) copper seed for ULSI copper metallization

International Symposium on IC Technology, Systems and Applications

Volumn 9, Issue , 2001, Pages 465-468

  Tan, Kee Tchuan ^a   Goh, Wang Ling ^a   Tse, Man Siu ^a   Liu, Kai Yu ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSIS; COPPER; ELECTROLESS PLATING; METALLIC FILMS; METALLIZING; PALLADIUM; PHYSICAL VAPOR DEPOSITION; TITANIUM NITRIDE;

COPPER FLASH UNDER-LAYER; ELECTROLESS COPPER; ULSI COPPER METALLIZATION;

ULSI CIRCUITS;

EID: 1842740452     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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