On Design of Electro-Thermally Compliant MEMS for Strength

Proceedings of the ASME Design Engineering Technical Conference

Volumn 2 B, Issue , 2003, Pages 987-997

  Saxena, Rajat ^a   Saxena, Anupam ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY KANPUR   (India)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; DEFORMATION; INTEGRATED CIRCUITS; MICROACTUATORS; OPTIMIZATION; POLYSILICON; STIFFNESS; STRESS ANALYSIS; TOPOLOGY;

MATERIAL DENSITIES; TOPOLOGY OPTIMIZATION;

MICROELECTROMECHANICAL DEVICES;

EID: 1842661562     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/detc2003/dac-48807     Document Type: Conference Paper

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