Creep behavior of copper-chromium in-situ composite

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 35 A, Issue 2, 2004, Pages 695-705

  Lee, K L ^a,b   Whitehouse, A F ^a   Hong, S I ^c   Russell, A M ^d  

^a UNIVERSITY OF LEICESTER   (United Kingdom)

^b Corus Construction and Industrial ^*  (United Kingdom)

^c Chungnam National University   (South Korea)

^d Iowa State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CREEP; CREEP TESTING; CRYSTAL MICROSTRUCTURE; DISLOCATIONS (CRYSTALS); FRACTURE MECHANICS; INTERFACIAL ENERGY; PLASTIC DEFORMATION; STRAIN RATE; TEMPERATURE;

ATHERMAL OBSTACLES; COPPER CHROMIUM COMPOSITE; CREEP RESISTANCE; MICROSTRUCTURAL STABILITY;

METALLIC MATRIX COMPOSITES;

EID: 1842631199     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-004-0380-5     Document Type: Article

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