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Journal of Materials Processing Technology

Volumn 113, Issue 1-3, 2001, Pages 610-616

Heavily drawn Cu-Fe-Ag and Cu-Fe-Cr microcomposites

(3) Song, J S a Hong, S I a Kim, H S a

a Chungnam National University (South Korea)

Author keywords

Conductivity; Deformation processing; Filament; Microcomposite; Strengthening

Indexed keywords

COPPER ALLOYS; DEFORMATION; HEAT TREATMENT; METAL DRAWING; METALLOGRAPHIC MICROSTRUCTURE; STRENGTHENING (METAL); TENSILE STRENGTH;

MICROCOMPOSITE WIRES;

COMPOSITE MATERIALS;

EID: 0035876534 PISSN: 09240136 EISSN: None Source Type: Journal
DOI: 10.1016/S0924-0136(01)00665-3 Document Type: Conference Paper

Times cited : (60)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.