Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process

Materials Science and Engineering: A

Volumn 281, Issue 1-2, 2000, Pages 189-197

  Ig Hong, Sun ^a   Hill, Mary Ann ^b  

^a Chungnam National University   (South Korea)

^b LOS ALAMOS NATIONAL LABORATORY   (United States)

Author keywords

Bundling process; Copper matrix; Niobium; TEM

Indexed keywords

BONDING; COPPER ALLOYS; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); METALLOGRAPHIC MICROSTRUCTURE; NIOBIUM; TEXTURES; TRANSMISSION ELECTRON MICROSCOPY; TWINNING; WIRE DRAWING;

BUNDLING; MICROCOMPOSITE WIRES;

METALLIC MATRIX COMPOSITES;

EID: 0033882429     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(99)00728-5     Document Type: Article

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