Strength and fracture of Cu-based filamentary nanocomposites

Key Engineering Materials

Volumn , Issue 187 PART 2, 2000, Pages 1207-1212

  Hong, S I ^a   Chung, J H ^a   Kim, H S ^a  

^a Chungnam National University   (South Korea)

Author keywords

Barrier Strengthening; Cu Nb; Filament; Grain Boundary; Nanocomposite; Strength; Substructure Strengthening

Indexed keywords

EID: 1842668702     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Article

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