Effect of Stress on the Properties of Copper Lines in Cu Interconnects

Electrochemical and Solid-State Letters

Volumn 7, Issue 4, 2004, Pages

  Balakumar, S ^a   Kumar, R ^a   Shimura, Y ^b   Namiki, K ^b   Fujimoto, M ^b   Toida, H ^b   Uchida, M ^b   Hara, Tohru ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b HOSEI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER INTERCONNECTION; COPPER LINES;

BACKSCATTERING; COPPER; ELECTRIC CONDUCTIVITY; ELECTROPLATING; GRAIN GROWTH; GRAIN SIZE AND SHAPE; INTERCONNECTION NETWORKS; PHYSICAL VAPOR DEPOSITION; STRESS ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

ELECTROCHEMISTRY;

EID: 1842582442     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1647994     Document Type: Article

References (9)

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