Modeling and characterization of a silicon condenser microphone

Journal of Micromechanics and Microengineering

Volumn 14, Issue 3, 2004, Pages 403-409

  Wang, W J ^a   Lin, R M ^a   Zou, Q B ^b   Li, X X ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b Maxim Integrated Products Inc   (Singapore)

^c SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

MECHANICAL CONSTANT; SINGLE-CHIP SILICON CONDENSERS;

COMPUTER SIMULATION; ELECTROSTATICS; EQUIVALENT CIRCUITS; FINITE ELEMENT METHOD; FREQUENCIES; MICROMACHINING; RESIDUAL STRESSES; RESONANCE; SILICON; VIBRATION CONTROL;

MICROPHONES;

EID: 1842535122     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/3/013     Document Type: Article

References (17)

1. Royer M, Holmen J O, Wurm M A, Adaland O S and Glenn M 1983 ZnO on Si integrated acoustic sensor Sensors Actuators A 4 357-62
2. Scheeper P R, Van der Donk A G H, Olthuis W and Bergveld P 1994 A review of silicon microphones Sensors Actuators A 4 1-11
3. Scheeper P R, Olthuis W and Bergveld P 1994 The design, fabrication and testing of corrugated silicon nitride diaphragms J. Microelectromech. Syst. 3 36-42
4. Zou Q B, Li Z J and Liu L T 1996 Design and fabrication of silicon condenser microphone using corrugated diaphragm technique J. Microelectromech. Syst. 5 197-204
5. Loeppert P V and Pederson M 2003 Miniature broadband acoustic transducer US Patent 6535460, Mar 18
6. Miao J M, Lin R M, Chen L Q, Zou Q B, Lim S Y and Seah S H 2002 Design considerations in micromachined silicon microphones Microelectron. J. 33 21-8
7. Wang W J, Lin R M and Li X 2003 Study of single deeply corrugated diaphragms for high-sensitivity microphones J. Micromech. Microeng. 13 184-9
8. Li X, Lin R M, Kek H S, Miao J M and Zou Q B 2001 Sensitivity-improved silicon condenser microphone with a novel single deeply corrugated diaphragm Sensors Actuators A 92 257-62
9. Nathanson H C, Newell W E, Wickstrom R A and Davis J R 1967 The resonant gate transistor IEEE Trans. Electron Devices 14 117-33
10. Bergqvist J 1993 Finite-element modeling and characterization of a silicon condenser microphone with a highly perforated backplate Sensors Actuators A 39 191-200
11. Zhang Y and Wise K D 1994 Performance of non-planar silicon diaphragms under large deflections J. Microelectromech. Syst. 3 59-68
12. Ying M, Zou Q and Yi S 1998 Finite-element analysis of silicon condenser microphones with corrugated diaphragms Finite Elem. Anal. Des. 30 163-73
13. Chau H L and Wise K D 1987 Scaling limits in batch fabricated silicon pressure sensors IEEE Trans. Electron Devices 34 850-8
14. Jerman J H 2001 The fabrication and use of micromachined corrugated silicon diaphragms Sensors Actuators A 21-23 988-92
15. Bergqvist J 1994 A silicon condenser microphone using bond and etch-back technology Sensors Actuators A 45 115-24
16. Rossi M 1988 Acoustics and Electroacoustics (Norwood: Artech House)
17. Kuhnel W and Hess G 1992 A silicon condenser microphone with structured back plate and silicon nitride membrane Sensors Actuators A 30 251-8