Inverse identification of thermal parameters using reduced-basis method

Computer Methods in Applied Mechanics and Engineering

Volumn 194, Issue 27-29, 2005, Pages 3090-3107

  Liu, G R ^a   Lee, J H ^a,b   Patera, A T ^c   Yang, Z L ^a   Lam, K Y ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b USA   (United States)

^c Department of Mechanical Engineering ^*  (United States)

Author keywords

Genetic algorithm; Inverse analysis; Inverse problems; Microelectronic package; Online analysis; Parameter identification; Reduced basis method

Indexed keywords

COMPUTATIONAL COMPLEXITY; ELECTRONICS PACKAGING; GENETIC ALGORITHMS; HEAT CONVECTION; HEAT TRANSFER; PROBLEM SOLVING;

INTERGENERATION-PROJECTION GENETIC ALGORITHM (IP-GA); INVERSE IDENTIFICATION METHOD; MICROELECTRONIC PACKAGE; REDUCED-BASIS METHOD;

COMPUTATIONAL METHODS;

CONVECTION; GENETIC ALGORITHM; MICROELECTRONICS;

EID: 18144416928     PISSN: 00457825     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cma.2004.08.003     Document Type: Article

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