Flip-Chip Bonded Arrays of Monolithically Integrated, Microlensed Vertical-Cavity Lasers and Resonant Photodetectors

IEEE Photonics Technology Letters

Volumn 11, Issue 3, 1999, Pages 304-306

  Louderback, D A ^a   Sjolund O ^a   Hegblom, E R ^a   Ko, J ^a,b   Coldren, L A ^a  

^a University of California   (United States)

^b OptiComp Corporation   (United States)

Author keywords

Integrated optoelectronics; Microlenses; Optical interconnects; Oxide mirrors; Photodetectors; Vertical cavity lasers

Indexed keywords

ELECTRIC CURRENTS; FLIP CHIP DEVICES; LENSES; OPTICAL INTERCONNECTS; PHOTODETECTORS; SEMICONDUCTOR LASERS;

VERTICAL CAVITY LASERS (VCL);

INTEGRATED OPTOELECTRONICS;

EID: 0033097904     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/68.748216     Document Type: Article

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