Towards optimizing enhanced surfaces for passive immersion cooled heat sinks

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 399-408

  Baldwin, Chris S ^a   Bhavnani, Sushil H ^a   Jaeger, Richard C ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT SINKS; HEAT TRANSFER; MICROELECTRONIC PROCESSING; NUCLEATE BOILING; SILICON WAFERS; SURFACE TREATMENT;

IMMERSION COOLING; PASSIVE IMMERSION COOLED HEAT SINKS; THIN FILM HEATERS;

COOLING;

EID: 0031620348     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)