A nondestructive automated defect detection system for silicon carbide wafers

Machine Vision and Applications

Volumn 16, Issue 3, 2005, Pages 170-176

  Kubota, Toshiro ^a   Talekar, Parag ^b   Ma, Xianyun ^b   Sudarshan, Tangali S ^b  

^a SIEMENS CORPORATE RESEARCH   (United States)

^b University of South Carolina   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIREFRINGENCE; ELECTRONIC EQUIPMENT; IMAGE PROCESSING; IMAGE RETRIEVAL; OPTICAL SYSTEMS; QUALITY CONTROL; SILICON CARBIDE; SILICON WAFERS;

IMAGE ACQUISITION; OPTICAL STRESS TECHNIQUES; SCREW DISLOCATION; STRUCTURAL DEFECTS;

ERROR DETECTION;

EID: 17744372710     PISSN: 09328092     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00138-004-0169-y     Document Type: Article

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