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Volumn 45, Issue 2, 2005, Pages 170-173

RF equivalent-circuit model of interconnect bends based on s-parameter measurements

Author keywords

Equivalent circuits; Interconnect models; Scattering parameters measurement

Indexed keywords

INTERCONNECT BENDS; INTERCONNECT MODELS; S-PARAMETER MEASUREMENTS; SCATTERING PARAMETERS MEASUREMENTS;

EID: 17444428113     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.20760     Document Type: Article
Times cited : (7)

References (10)
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    • B. Kleveland, C.H. Diaz, D. Vook, L. Madden, T.H. Lee, and S.S. Wong, Exploiting CMOS reverse interconnect scaling in multigiga-hertz amplifier and oscillator design, IEEE J Solid-State Cire 36 (2001), 1480-1489.
    • (2001) IEEE J Solid-state Cire , vol.36 , pp. 1480-1489
    • Kleveland, B.1    Diaz, C.H.2    Vook, D.3    Madden, L.4    Lee, T.H.5    Wong, S.S.6
  • 2
    • 0035273367 scopus 로고    scopus 로고
    • 3D integration of RF circuits using Si micromachining
    • L.P.B. Katehi, J.F. Harvey, and K.J. Herrick, 3D integration of RF circuits using Si micromachining, IEEE Microwave Mag 2 (2001), 30-39.
    • (2001) IEEE Microwave Mag , vol.2 , pp. 30-39
    • Katehi, L.P.B.1    Harvey, J.F.2    Herrick, K.J.3
  • 3
    • 0033363189 scopus 로고    scopus 로고
    • CAD-oriented equivalent circuit modeling of on-chip interconnects for RF integrated circuits in CMOS technology
    • J. Zheng, Y.C. Hahm, A. Weisshaar, and V.K. Tripathi, CAD-oriented equivalent circuit modeling of on-chip interconnects for RF integrated circuits in CMOS technology, IEEE MTT-s Int Microwave Symp Dig 1 (1999), 35-38.
    • (1999) IEEE MTT-s Int Microwave Symp Dig , vol.1 , pp. 35-38
    • Zheng, J.1    Hahm, Y.C.2    Weisshaar, A.3    Tripathi, V.K.4
  • 4
    • 0032184443 scopus 로고    scopus 로고
    • Full-wave analysis of high-speed interconnects using complex frequency hopping
    • R. Achar, M.S. Nakhla, and Q. Zhang, Full-wave analysis of high-speed interconnects using complex frequency hopping, IEEE Trans CAD ICs Syst 17 (1998), 997-1016.
    • (1998) IEEE Trans CAD ICs Syst , vol.17 , pp. 997-1016
    • Achar, R.1    Nakhla, M.S.2    Zhang, Q.3
  • 5
    • 0027798939 scopus 로고
    • High-speed VLSI interconnect modeling based on S-parameter measurements
    • Y. Eo and W.R. Eisenstadt, High-speed VLSI interconnect modeling based on S-parameter measurements, IEEE Trans Comp Hybrids Manufact Technol 16 (1993), 555-562.
    • (1993) IEEE Trans Comp Hybrids Manufact Technol , vol.16 , pp. 555-562
    • Eo, Y.1    Eisenstadt, W.R.2
  • 8
    • 0037396279 scopus 로고    scopus 로고
    • RF and microwave network characterization: A concept-map-based tutorial
    • K.C. Gupta, R. Ramadoss, and H. Zhang, RF and microwave network characterization: A concept-map-based tutorial, IEEE Trans Microwave Theory Tech MTT-51 (2003), 1326-1329.
    • (2003) IEEE Trans Microwave Theory Tech , vol.MTT-51 , pp. 1326-1329
    • Gupta, K.C.1    Ramadoss, R.2    Zhang, H.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.