Thick-film lithography using laser write

Microsystem Technologies

Volumn 9, Issue 1-2, 2003, Pages 17-22

  Cheng, Y ^a,b,c   Huang, T ^b   Chieng, C C ^c  

^a TSINGHUA UNIVERSITY   (China)

^b NATIONAL SYNCHROTRON RADIATION RESEARCH CENTER   (Taiwan)

^c NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DEPTH OF FOCUS (DOF); INTENSITY FLUCTUATIONS; THICK FILM LITHOGRAPHY; X RAY MASK;

ANTIREFLECTION COATINGS; DIFFRACTION; LASERS; MASKS; MICROELECTRONICS; THICK FILMS; TRANSPARENCY; ULTRAVIOLET RADIATION;

LITHOGRAPHY;

EID: 17444422919     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-002-0201-y     Document Type: Article

References (10)

1. Cheng Y; Shew BY; Lin CY; Wei DH (1999) Deep X-ray lithography developed at SRRC. Proc of NSC, Part A Phys Sci Eng 24(4): 537-543
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3. Cheng Y; Shew BY; Lin CH; Chyu MK (2000) Concepts for creating ultra deep trenches using deep X-ray lithography. Sensors and Actuators 82: 205-209
4. Cheng Y; Lin CY; Wei DH; Loechel B; Gruetzner G (1999) Wall profile of thick photoresist generated via contact printing. IEEE J MEMS 8(1): 18-26
5. www.azresist.com/graphics/refract.jpg
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10. Private communications with Heidelberg Instruments