Influence of Bath Composition to Via-Filling by Copper Electroplating

Journal of The Japan Institute of Electronics Packaging

Volumn 3, Issue 4, 2000, Pages 324-329

  Kobayashi, Takeshi ^a   Kawasaki, Junichi ^a   Mihara, Kuniaki ^a   Yamashita, Tsugito ^a   Honma, Hideo ^a  

^a KANTO GAKUIN UNIVERSITY   (Japan)

Author keywords

Additives; Build up; Copper Electroplating; Printed Wiring Boards; Via Filling

Indexed keywords

EID: 85009577221     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.3.324     Document Type: Article

References (3)

1. Masayuki Yokoi, Saburo Konishi and Tadao Hayashi: “Adsorption Behavior of Polyoxyethyleneglycole on the Copper Surface in an Acid Copper Sulfate Bath”, DENKI Kagaku, Vol. 52, No. 4, pp. 218-223, 1984.
2. James J. Kelly and Alan C. West: “Copper Deposition in the Presence of Polyethylene Glycol I Quartz Crystal Microbalance Study”, J. Electrochem. Soc., Vol. 145, No. 10, pp. 3472-3476, 1998.
3. James J. Kelly and Alan C. West: “Copper Deposition in the Presence of Polyethylene Glycol II Electrochemical Impedance Spectroscopy”, J. Electrochem. Soc., Vol. 145, No. 10, pp. 3477-3581, 1998.